• 天津2018年大气污染防治工作方案出台 2019-06-11
  • 高考评卷在三所高校进行 确保高质高效完成评卷任务 2019-06-11
  • 大米-热门标签-华商生活 2019-06-03
  • “大头儿子”著作权纠纷案二审开庭 2019-06-01
  • 习近平为诊治“长江病”把脉开方 2019-06-01
  • 护肤品达不到的效果怎么办? 让这些网红皮肤管理项目来帮你 2019-05-25
  • 【北京中汽双会车型报价】北京中汽双会4S店车型价格 2019-05-25
  • 昌都市图书馆首个全民阅读推广项目结题 2019-05-21
  • 靠山山倒不如靠自己。远水救不了近火,这样的简单道理都不懂该有这样一劫 2019-05-19
  • 习近平集体会见上海合作组织成员国安全会议秘书会议外方代表团团长 2019-05-19
  • 上港竟遭日球队头球羞辱 球迷:这么踢出局不远了 2019-05-14
  • 民主党派中央和全国工商联领导人记者会 2019-05-14
  • 西藏已具备血液核酸检测能力 2019-05-13
  • 印度公司食言,坑惨了缅甸商人! 2019-05-13
  • [网连中国]赛龙舟 包粽子 办诗会……全国各地品民俗迎端午 2019-05-12
  • 内蒙古福彩快三:IPC Online Presentation Library

    内蒙古快三开奖号 www.mnxj.net Welcome to the IPC Online Presentation Library.? Viewing the presentations is a benefit of IPC membership. To view the presentations you will need to log on to IPC's Members-Only Web site. ?

    ?
    Slide IconSlideshow
    Podcast Podcast
    BookBook

    Technology Presentations

    Slide IconEnabling I/O Optimization with 3D SoC, SIP and PCB Co-design

    Presentation by Humair Mandavia, Chief Strategy Officer at Zuken

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona, September 11, 2013

    Slide IconThe Impact of Different Interposers on Power Saving for Memory Modules

    Presentation by Nozad Karim, VP of Electrical Engineering and Characterization at Amkor Technology, Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona

    Slide IconThinking Small: Building a Business out of Nanotechnology

    Presentation by Dr. Patrick Murray, VP of Research and Development, Nanophase Technologies

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona

    Slide Icon

    Advanced Package Migration to System Level Integration

    Presentation by David Hiner, Sr. Director Chip-on-Chip Technology at Amkor Technology

    This presentation, the keynote address, was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide Icon

    Films for Improved Reliability in PCB and IC Packages

    Presentation by Chris Hunrath, VP of Technology for Integral Technology

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

    Slide Icon

    PCB Fabrication, Challenges & Solutions

    Presentation by by Raj Kumar, VP of Technology – PCB of Viasystems Group, Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

    Slide Icon

    Leveraging PCB Infrastructure to Achieve Ultra-Fine Cu Geometries

    Presentation by Michael Deley, Business Development Manager at Averatek Corporation

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

    Slide Icon

    Polymer Challenges on the Road to 3D Integration

    Presentation by Jeff Gotro, PhD, CMC, President of InnoCentrix, LLC

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

    Slide Icon

    Design of High-performance DIMM-in-a-PACKAGE (DIAP) On-board Memory Module

    Presentation by Zhuowen Sun, Staff Engineer at Invensas Corporation

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide Icon

    Sintering Pastes: A Spectrum Solution to Electrical and Thermal Conduction in the Z-Axis

    Presentation by Catherine Shearer, Senior Scientist, Ormet Circuits Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide IconImplementation of High Speed Plating for Copper Pillar Fabrication

    Presentation by Lynn Michaelson, Senior Materials Scientist at Technic Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide IconOpportunities and Challenges for 2.5D/3D Glass Interposers

    Presentation by Scott C. Pollard, Manager, Integration Technologies Science & Technology at Corning, Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide IconTrends in Advanced Circuit Board Technologies and the Impact on the Chip World

    Presentation by Dr. H. Nakahara, President, N.T. Information Ltd.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide Icon "Silicon Interposers: Advances and Alternatives"

    Presentation by Linda C. Mathew, Senior Analyst, TechSearch International, Inc.

    This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

    Slide Icon "Manufacturing with Fiber Optics"

    Presentation by Matt Hamand of Rockwell Collins

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Printed Electronics: An Overview"

    Presentation by Marc Chason of Marc Chason and Associates, Inc. on behalf of Dan Gamota of Jabil Electronics

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Advance in Flexible Printed Lighting Technology for High Growth Markets"

    Presentation by Marc Chason of Marc Chason and Associates, Inc.

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "BGA Voiding in Flexible Circuits"

    Presentation by Mitch Holzer of Cookson Electronics

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Supporting Electronic Innovations: Printed Electronics Opportunities"

    Presentation by Happy Holden of GENTEX Corporation

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Aspect Ratio Does Not Matter Anymore"

    Presentation by Nick Koop of Minco Products, Inc.

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Alternative Approaches to the Manufacture of Rigid Flex Circuit Assemblies"

    Presentation by Joe Fjelstad of Silicon Pipe, Inc.

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "IPC-2223 Revision C Overview"

    Presentation by Mark Finstad of Flexible Circuit Technologies, Inc.

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Ask the Flexpert"

    Presentation by Mark Finstad of Flexible Circuit Technologies, Inc. and Mark Verbrugge of Pica Manufacturing Solutions

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Design, Fabrication and Electrical Analysis of High Speed Flex"

    Presentation by Glen Oliver of DuPont Electronic Technologies

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "Tin Whisker Mitigation in Assembly"

    Presentation by Polina Snugovsky, Ph.D., Sc.D. of Celestica

    This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

    Slide Icon "Special Consideration for Medical Sector: Product Reliability Issues Due to Pb-free"

    Presentation by Po Tse of Philips Healthcare

    This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

    Slide Icon "Research at UNT on Metal (Tin, Zinc, and Cadmium) Whiskers"

    Presentation by Aleksandra Fortier, Ph.D., of the University of North Texas

    This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

    Slide Icon "Tin Whisker Mitigation Process"

    Presentation by Scott Sentz of AEM, Inc.

    This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

    Slide Icon "Mitigation Measurements and Whisker Survey of Commercial Components"

    Presentation by Martin Wickham of NPL (UK)

    This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

    Slide Icon "An Investigation of Whisker Growth on Tin Coated Wire and Braid"

    Presentation by David Hillman of Rockwell Collins and Tom Lesniewski of Northrup Grumman

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Backward Compatable Assembly, Microstructure and Thermal Reliability on an Extremely Large Ball Grid Array"

    Presentation by Raiyo Aspandiar of Intel Corporation

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Assembly and Reliability of 1704 I/O FCBGA & FPBGAs"

    Presentation by Reza Ghaffarian, Ph.D. of NASA/Jet Propulsion Laboratory (JPL)

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes"

    Presentation by Brandon Judd of Indium Corporation

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Halogen-free Lead-free Solder Paste with Advanced Activator Technology"

    Presentation by Xiang Wei, Ph.D., of Kester

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere"

    Presentation by Ning-Chen Lee, Ph.D. of Indium Corporation

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "An Investigation into Low Temperature Tin-bismuth and Tin-bismuth-silver Lead-free Alloy Solder Pastes"

    Presentation by Jasmir Bath of Christopher Associates

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish"

    Presentation by Julie Silk of Agilent Technologies

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation"

    Presentation by David Lee of Johns Hopkins Applied Physics Laboratory

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "PCB Trace Impedance: Impact of Localized PCB Copper Density"

    Presentation by Gary Brist of Intel Corporation

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology"

    Presentation by Jerry Chia of Intel Corporation

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Whiskers and Alternative Surface Finishes at Press-in Technology"

    Presentation by Dr. Hans-Peter Tranitz of Continental Automotive GmbH

    This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Soldering and Assembly Defects - Causes and Cures"

    Presentation by Bob Willis of SMART Group

    This presentation was recorded live as a webinar on January 12, 2012

    Slide Icon "Component Characteristics and Reliability Assessment of Lead Free Solder for Space Electronics Hardware"

    Presentation by Jelena Bradic of Com Dev, Ltd.

    This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

    Slide Icon "Maximizing the Value of Automatic Inspection in PCB Assembly"

    Presentation by Chrys Shea of Shea Engineering Services

    This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

    Slide Icon "BGA Processing for Reliability: Dealing with Dissimilar Alloys and Avoiding Head on Pillow"

    Presentation by Jason Fullerton of ACI Technologies, Inc.

    This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

    Slide Icon "The Effect of Coating and Potting on the Reliability of QFN Devices"

    Presentation by Sheryl Tulkoff and Dr. Nathan Blattau of DfR Solutions

    This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

    Slide Icon "Minimizing the Variables of Mechanical Drilling"

    Presentation by Ian Hemmings of Tapco Circuit Supply

    This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

    Slide Icon "New Developments in Materials for Rigid Flex Boards"

    Presentation by Anthony Welo of Arlon

    This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

    Slide Icon "Performance Reliability Data for Flex/Rigid-Flex PWBs"

    Presentation by John Bauer of Rockwell Collins

    This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

    Slide Icon "OEM Technology Requirements"

    Presentation by Eric Malo of Research In Motion

    This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

    Slide Icon "FR4-CCL Reclassification Explained — An update from UL"

    Presentation by Crystal Vanderpan of UL

    This presentation was recorded live as a webinar on May 4, 2011

    Slide Icon "Practical Aspects for Subtractive Etching of High Density Interconnects "

    Presentation by Don Ball of Chemcut Corporation

    This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

    Slide Icon "Final Finishes for HDI"

    Presentation by Dr. Martin Bayes of Dow Electronic Materials

    This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

    Slide Icon "Photoresist Challenges and Opportunities for Imaging HDI Designs "

    Presentation by Dave McGregor of DuPont

    This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

    Slide Icon "Via Filling and Plugging Considerations for HDI"

    Presentation by Mike Carano of OMG Electronic Chemicals

    This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

    Slide Icon "Printed Electronic Technologies: Perspective of a PCB Manufacturer"

    Presentation by Raj Kumar of DDi Corp.

    This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

    Slide Icon "The Intersection of Printed Electronics and PCB Assembly"

    Presentation by John Andresakis of Oak-Mitsui Technologies

    This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

    Slide Icon "Applications, Needs and Requirements for Printed Electronics in Aerospace"

    Presentation by Jeff Duce of Boeing

    This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

    Slide Icon "Tin Whiskers Grown on PCBA"

    Presentation by Paco Solis of Foresite, Inc.

    This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

    Slide Icon "Materials: Evaluation of a Nanotechnology Based Component Surface Finish"

    Presentation by Robert Farrell of Benchmark Electronics

    This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

    Slide Icon "Aerospace and Defense Response to Tin Whiskers"

    Presentation by Ted Schnetker of Hamilton Sundstrand

    This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

    Slide Icon "Study of Tin Whisker Inhibiting Systems, Controlling the Copper Substrate Roughness and Controlling the Tin Deposit Crystal Structure"

    Presentation by George Milad of Uyemora International Corporation

    This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

    Slide Icon "Thermally Conductive Printed Circuit Board Solutions"

    Presentation by Greg Smith of Milplex Circuits, Inc. (Canada)

    This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

    Slide Icon "New Materials and Their Impact on Thermal Management: Solder Mask"

    Presentation by David Vaughan of Taiyo America

    This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

    Slide Icon "Thermal Management for LED Applications"

    Presentation by Yash Sutariya of Saturn Electronics Corporation

    This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

    Slide Icon "Polymide Based Materials for Electronic Applications"

    Presentation by Tom Lantzer of DuPont Circuit and Packaging Materials

    This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010

    Slide Icon "New PCB Laminates for Use in High Temperature and Harsh Chemistry Environments"

    Presentation by John Conrood of Rogers Corporation

    This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

    Slide Icon "Electrical vs. Mechanical Requirements and Their Impact on Material Selection"

    Presentation by Mark Verbrugge of Minco Products and Sidney Cox of DuPont

    This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

    Slide Icon "Telecommunications Case Studies Address Head-in-Pillow (HnP) Defects and Mitigation through Assembly Process Modification and Control"

    Presentation by George Wenger of the Andrew Division of CommScope

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

    Slide Icon "Characterizing the Lead-free Impact on PCB Pad Craters"

    Presentation by Brian Roggeman of AREA Consortium in conjunction with Advanced Process Laboratory, Universal Instruments Corporation

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

    Slide Icon "Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys"

    Presentation by Kristen Troxel, Hewlett-Packard Company

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

    Slide Icon "Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes"

    Presentation by Raiyomand Aspandiar, Intel Corporation

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

    Slide Icon "The Lean SMT Line"

    Presentation by Kenny Heifner of SMS Technologies, Inc.

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

    Slide Icon "Implementing Quality and Reliability on the Assembly Line"

    Presentation by David Bergman of IPC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Solder Creep-Fatigue Model Parameters for SAC & SnAg Solder Joint Reliability Estimation"

    Presentation by Werner Engelmaier of Engelmaier Associates, LLC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Filling in the Gaps in Lead-free Reliability Modeling and Testing"

    Presentation by Jean-Paul Clech of EPSI Inc.

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Constitutive and Failure Behavior of SnAgCu Solder Joints"

    Presentation by Dr. Ganesh Subbarayan of Purdue University

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Improving Your Efficiency"

    Presentation by Sean Murray of Assembléon

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

    Slide Icon "Improving Your Efficiency"

    Presentation by Eric Slezak of Indium Corporation

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

    Slide Icon "IPC-9592: Scope, Applicable Documents and Terms & Definitions"

    Presentation by Tom Newton, Director of PCB Programs, Standards and Technology for IPC

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Design for Reliability & Appendix A, Derating Guidelines"

    Presentation by Dr. Scott Strand of IBM

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Product Specification, Documentation & Appendix B"

    Presentation by Mike Model of Lineage Power

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Design Verification Testing & Appendix C"

    Presentation by Don Gerstle of Murata Power Solutions

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Environmental Stress Testing"

    Presentation by T. Paul Parker of Lineage Power from a technical paper authored by Dr. Bill Tian, Hewlett-Packard

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Electromagnetic Susceptibility Testing"

    Presentation by Jerry Strunk of Lineage Power

    This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

    Slide Icon "IPC-9592: Quality Processes"

    Presentation by Lynn Simmons of Dell, Inc.

    This presentation was recorded live in Irving, Texas, at the IPC-9592 Conference, November 6, 2008

    Audio "Nozzle Design for Cleaning High Density, Low Profile Assemblies"

    Presentation by Linda Woody of Lockheed Martin Martin Missiles and Fire Control Systems

    This presentation was recorded live in Rosemont, Illinois, at the IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium, October 29, 2008

    Slide Icon "Roadmapping HDI — Interconnect Technology Analysis"

    Presentation by Jack Fisher, Chairman of the IPC National Technology Roadmap For Electronic Interconnections and a consultant on interconnect technology

    This presentation was recorded live in Irving, Texas during the IPC HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008

    Slide Icon "Ionic Analysis of Common Beverages Spilled on Electronics"

    Presentation by Bev Christian of Research In Motion

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

    Slide Icon "The OEM View: PWB Level Integration, Challenges, & Roadmap Requirements"

    Presentation by Jim Fuller of Endicott Interconnect Technology Inc.

    This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

    Slide Icon "Abilities and Gaps: Image Transfer Technologies in PWB Fabrication"

    Presentation by Karl Dietz, Ph.D., of DuPont

    This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

    Slide Icon "Innovations: Leadership Challenge in PCB System Development Design"

    Presentation by Happy Holden of Mentor Graphics

    This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

    Slide Icon Ball Grid Array Update

    Design and Assembly Process Standard for Ball Grid Array update

     

    Slide Icon IPC-2152

    Standard for Determining Current-Carrying Capacity in Printed Board Design

     

    Slide Icon IPC-4811

    Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

     

    Slide Icon IPC-6017

    John Perry, IPC staff liaison of the IPC D-53 Embedded Device Performance Subcommittee, provides an overview of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices.

     

    Slide Icon IPC 7711/7721 Revision B

    Rework, Modification & Repair of Electronic Assemblies

     

    Slide Icon IPC-9252

    Cliff Maddox, co-chairman of the IPC 7-32c committee, provides an overview of IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards.

     

    Slide Icon IPC-9592, Performance Parameters for Power Conversion Devices

    Dr. Scott Strand, senior technical staff member, integrated technology, IBM, provides an overview of IPC-9592.

     

    Slide Icon IPC-J-STD-004

    Revision B Requirements for Soldering Fluxes

     

    Slide Icon IPC-J-STD-075

    Paul Krystek, lead co-chairman of the ECA/IPC/JEDEC J-STD-075 committee, provides an overview of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

     

    Audio Medical electronics manufacturing and the RoHS revision

    Fred Loneker, a senior manager with ENVIRON International Corp., talks about the implications the RoHS revision draft will have on the medical electronics industry.

     

    Slide Icon "Solder Alloy Test Methods: A Status Report"

    Greg Munie, IPC conference director, provides an overview of the development of a new alloy test standard.

     

    Slide Icon "New Generation - Thermal stress simulation for evaluation of printed circuit boards"

    An introduction to printed circuit board troubleshooting

     
    Top

    Management Presentations

    Slide Icon "Business Outlook: The Global Electronics Industry"

    Presentation by Presentation by Walt Custer of Custer Consulting Group

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "Developing a Disaster Preparedness Plan"

    Presentation by John Sharp, Corporate Product Compliance Manager for TriQuint Semiconductor

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "Best Practices of Customer Relations: Secrets of a Certified EMS Program Manager"

    Presentation by Chris Narup, Supervisor-Sales and Marketing, John Deere Electronic Solutions

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "Disruptive Environmental Trends (and Some Other Things of Concern)"

    Presentation by Fern Abrams, Director Government Relations and Environmental Policy, IPC

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "The Dynamic EMS Industry"

    Presentation by Jack Calderon, Managing Director at Lincoln International

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "HDI — Altering the Competitive Landscape for North America"

    Presentation by Mike Carano of OMG Electronic Chemicals

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Where is the Gap? What Our Customers Need from Us"

    Presentation by Michael Goeringer of Arc-Tronics

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Breaking Into Game Changing Technologies: Embedded"

    Presentation by Jim Fuller of Endicott Interconnect Technologies, Inc.

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "How to Achieve High Speeds Without Breaking the Bank"

    Presentation by Mike Freda of Oracle’s Semiconductor Packaging & Technology Group

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Overview of Latin America’s Economy and the Electronics Industry"

    Presentation by Sree Bhagwat of IPC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Creating and Following the EMS Dashboard"

    Presentation by Rick Herndon of Firstronic, LLC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Where is the Gap? What Our Customers Need from Us"

    Presentation by Scott Meyer of UTC Aerospace Systems

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Creating and Following the EMS Dashboard"

    Presentation by David Hollingsworth of Ascentron, Inc.

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "Transitioning from Rigid to Flex/Rigid-Flex PCB Manufacturing"

    Presentation by Yash Sutariya of Saturn Electronics/Saturn Flex Systems, Inc.

    This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

    Slide Icon "China Perspective of the PCB Industry"

    Presentation by George Dudnikov of Founder PCB

    This presentation was recorded live in San Diego, California during the PCB Executive Management Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "The State of Consumer Tech"

    Presentation by Shawn DuBravac of CEA

    This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "ERP Systems and Cloud Computing"

    Presentation by Marty Bentley of EPIC Technologies

    This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Trends in Distribution"

    Presentation by Dave Doherty, Vice President – Global Supplier and Product Operations with Digi-Key Corporation

    This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "EMS Growth in India"

    Presentation by Gary Barnier, Director of Business Development for North America with Centum Electronics

    This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

    Slide Icon "Military Technology Trends"

    Presentation by Stephen Cambone, Executive VP, Strategic Development for QinetiQ NA

    This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

    Slide Icon "Export Control Reform: Overview and Potential Impact on the Military Electronics Industry"

    Presentation by Peter Lichtenbaum, Partner in Covington & Burling, LLP

    This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

    Slide Icon "The Military Market Today and What it Means for Tomorrow"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

    Slide Icon "Company Spotlight"

    Presentation by Nilesh Naik of OneSource Group

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon "Any Layer Via Interconnects Using Sintered Paste"

    Presentation by James Haley of Ormet Circuits

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon "IPC International Technology Roadmap for Electronic Interconnections"

    Presentation by David Bergman of IPC

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon "Disruptive Environmental Trends"

    Presentation by Fern Abrams of IPC

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon "Trends in the Flexible Circuit Industry"

    Presentation by Sharon Starr of IPC

    This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

    Slide Icon "Developing a Flexible Product Compliance Management System"

    Presentation by Jacklin Adams of IBM

    This presentation was recorded live in Boston, Massachussetts at IPC conference "It's Not Easy Being Green: Roadmap to Compliance", May 11, 2011

    Slide Icon "EMS Executive Management Meeting — IPC APEX EXPO™ 2011"

    Presentations:
    • Expanding into High-Growth Emerging Markets: Talent as a Critical Success Factor for Asia-Pacific
      David Everheart of Aperion Global


    • How to Start a Manufacturing Operation in Mexico
      Eduardo R. Saavedra of The Offshore Group


    • How to Start Your Business in India
      Gunjan Bagla of Amritt, Inc.

    These presentations were recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

    Slide Icon "Technology Roadmap for Aerospace & Defense Electronics Assembly Industry"

    Presentation by Bill Murphy of Lockheed Martin

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

    Slide Icon "A Laminator's Perspective of the PCB Market"

    Presentation by Raymond Sharpe of Isola Group S.A.R.L.

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

    Slide Icon "Bridging the Gap Between Design and Fabrication — A PCB Manufacturer's Perspective"

    Presentation by Yash Sutariya of Saturn Electronics Corporation and Saturn Flex Systems, Inc.

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

    Slide Icon "Impact of Materials Shortage"

    Presentation by Rick Pierson of iSuppli Corporation

    This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010

    Slide Icon "Developing a Counterfeit Parts Control Plan"

    Presentation by Bruce Mahone, SAE International

    This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

    Slide Icon "Regulations, Requirements & Compliance for Military Commercial Exports"

    Presentation by Bob Davis, Excelerate, Inc.

    This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

    Slide Icon "Business Opportunities for Aerospace/Government and Consumer Electronics Flex Circuit Manufacturers"

    Presentation by Al Wasserzug, Vulcan Flex Circuit Corporation and Jay Desai, MFLEX

    This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

    Slide Icon "Are the Consequences of Industry Consolidation Good or Bad?"

    Presentation by Jack Calderon, Lincoln International

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO? 2010, April 6-8, 2010

    Slide Icon "How Does Cost Accounting Impact Pricing?"

    Presentation by Brian Throneberry, API Technologies

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO? 2010, April 6-8, 2010

    Slide Icon "High Brightness LEDs: Opportunities, Technologies and Challenges"

    Presentation by Ed Smith, Avnet Electronics Marketing Americas

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO? 2010, April 6-8, 2010

    Slide Icon "Recommendations for the North American Electronic Interconnect Industry Support for the Department of Defense"

    Presentation by:
    • James Fuller, Endicott Interconnect Technologies
    • Joseph O’Neil, Hunter Technologies
    • Mikel Williams, DDi Corp.

    This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

    Slide Icon "Interconnect Opportunities & Challenges"

    Presentation by Sydney Pope of the U.S. Department of Defense

    This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

    Slide Icon "Strategies for Fighting Counterfeiting"

    Presentation by Debra Eggeman of IDEA (Independent Distributors of Electronics Association)

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Possible IPC Counterfeit Avoidance Management Technique"

    Presentation by Dennis Fritz of SAIC and MacDermid, Inc.

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Suspect/Counterfeit Electronic Components and Risk Mitigation"

    Presentation by Rick Stanton of Symetrics Industries LLC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "High Performance Work Teams"

    Presentation by Leo Reynolds, Consultant

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

    Slide Icon "Opportunities in Large Format Electronics"

    Presentation by Mike Carano of OMG Electronic Chemicals

    This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

    Slide Icon "Partnering to Improve Your Business"

    Presentation by John Hartner of Dover Electronic Technologies

    This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

    Slide Icon "Death of a PCB Salesman"

    Presentation by Greg Papandrew of Bare Board Group Inc.

    This presentation was recorded at IPC’s PCB Executive Management Council Meeting in conjunction with the IPC Executive Marketing & Technology Forum Conference and Management Meetings in Kissimmee, Florida, October 29-30, 2008

    Slide Icon "Opportunities in Low-Cost & Emerging Regions"

    Presentation by Mark C. Hehl of Hehl & Associates

    This presentation was recorded during the IPC SMEMA Management Council Meetings in conjuction with the IPC Executive Marketing & Technology Forum Council and Management Meetings in Kissimmee, Florida, October 29-30, 2008

    Slide Icon "Your Company and the Research & Experimentation Tax Credit"

    Presentation by TJ Sponsel II of McGuire Sponsel LLC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

    Slide Icon "Reducing Costs & Avoiding Risk in the Global Market"

    Presentation by Lawrence M. Friedman of Barnes, Richardson & Colburn

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

    Podcast The R&D Tax Credit

    A special presentation with IPC and McGuire Sponsel LLC

     

    Podcast Building a Marketing Strategy

    Karen Carpenter outlines best practices in marketing.

     

    Podcast Death of a PCB Salesman

    Greg Papandrew discusses best practices in sales.

     

    Podcast IPC Midwest Conference Highlights

    IPC technical conference director Greg Munie shares highlights from the IPC Midwest Conference and Exhibition.

     

    Podcast Looking ahead to 2009

    IPC President Denny McGuirk shares IPC’s goals for its members and the association in 2009.

     

    Podcast Put Your Stamp On It

    Attorney Jason Mirabito weighs in on how to effectively develop a patent strategy.

     

    Podcast The Innovation Evolution

    Innovation expert Robert Tucker describes the best path to optimal innovation.

     
    Top

    Environmental Presentations

    Slide Icon "California Safer Consumer Products Regulation"

    Presentation by Mike Kirschner, Principal Consultant at Environ

    This is the sixth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

    Slide Icon "Voluntary Sustainability Initiatives"

    Presentation by Jocelyn Cascio, Supply Chain sustainability Manager at Intel

    This is the fifth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

    Slide Icon "EU REACH Update"

    Presentation by Mike Kirschner, Principal Consultant, of Environ

    This is the fourth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

    Slide Icon "Alternatives Assessment, Finding Better Alternatives to Restricted Substances"

    Presentation by Helen Holder, Corporate Material Selection Manager of Hewlett-Packard

    This is the third of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

    Slide Icon "Voluntary Initiatives: CDP, Measuring and reporting climate and water risk"

    Presentation by Chrystina Gastelum of CDP

    This is the second of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

    Slide Icon "Canadian Chemicals Management Plan"

    Presentation by Bev Christian, Director of Materials Interconnection at Blackberry

    This is the first of six presentations from the It's Not Easy Being Green conference at Boston, June 5, 2013

    Slide Icon "Disruptive Environmental Trends (and Some Other Things of Concern)"

    Presentation by Fern Abrams, Director Government Relations and Environmental Policy, IPC

    This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

    Slide Icon "Energy Efficiency and Global Warming: A View from the Trenches"

    Presentation by William Haas of Seagate Technology

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "California’s Safer Consumer Products Regulations"

    Presentation by Art Fong of IBM Corporation

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "iNEMI 2013 Environmentally Sustainable Electronics"

    Presentation by Aimee Siegler of Benchmark Electronics

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "EPA and the Future of Sustainable Products"

    Presentation by John Katz of the EPA

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "Streamlining Data Paths for Product Eco-footprinting"

    Presentation by N. Nagaraj, Ph.D., PE, of Papros, Inc.

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "1752 Builder and Spreadsheet"

    Presentation by John Kudet of PTC

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "India RoHS/WEEE, Vietnam RoHS"

    Presentation by Mike Kirschner of ENVIRON

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "The Gallium Arsenide Industry Team (GAIT)"

    Presentation by John Sharp of TriQuint Semiconductor, Inc.

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "EU REACH Update"

    Presentation by Mike Kirschner of ENVIRON

    This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

    Slide Icon "Environmental Policy and Corporate Social Responsibility"

    Presentation by Fern Abrams of IPC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

    Slide Icon "2-18/2-18b 175X Standard V1.1 and V2.0 Comparisons"

    Presentation by Mark Frimann of Texas Instruments

    This presentation was recorded live in Boston, Massachussetts at the IPC conference "It's Not Easy Being Green: Roadmap for Compliance," May 11, 2011

    Slide Icon "IPC 1752 — Standard for Materials Declaration"

    Presentation by Mark Frimann of Texas Instruments

    This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

    Slide Icon "Flame Retardants — Fire Safety, Regulatory Status & Sustainability"

    Presentation by Susan D. Landry of Albemarle Corporation

    This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

    Slide Icon "Update on Critical Environmental Issues for Electronics"

    Presentation by Stephanie Castorina, Manager of Environmental Programs for IPC

    This presentation was recorded live in Minneapolis, Minnesota at the Surface Mount Technology Association (SMTA) Upper Midwest (UMW) Chapter conference, March 10, 2009

    Slide Icon "Halogen Free Update — Environmental Regulations and Review"

    Presentation by Susan D. Landry of Albemarle Corporation

    This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements," February 4–5, 2009

    Slide Icon "Green Chemistry Initiative Final Report"

    Presentation by Maureen Gorsen of the State of California

    This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements", February 4–5, 2009

    Slide Icon "Environmental Megatrends and the Future of the Electronics Industry"

    Presentation by Paul Goodman of ERA Technology Ltd.

    This presentation was recorded live in Kissimmee, Florida at IPC’s Executive Marketing & Technology Forum Conference and Management Meetings, October 29–30, 2008

    Slide Icon "More Than One Way to Lead-Free: Status Report on Lead Free Processes"

    Presentation by Leo Lambert of EPTAC Corporation

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

    Slide Icon "Impact of the Öko-Institut Recommendations on an Avionics OEM"

    Presentation by David Hillman of Rockwell Collins

    This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

    Slide Icon "US EPA Flame Retardants in Printed Circuit Boards Partnership"

    Presentation by Fern Abrams Director, Government Relations and Environmental Policy

    This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

    Slide Icon "Summary of Öko–Institut Recommendations & General Issues"

    Presentation by Paul Goodman of ERA Technology Ltd.

    This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

    Audio DSW Rule: Industry Perspective

    Bret Bruhn, environmental operations manager for Merix Corporation in North America, and member of the IPC EHS steering committee, shares the benefits the new definition of solid waste rule brings the industry and provides an example of how the new rule will be used.

     

    Audio Halogen-free challenges

    Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free.

     

    Podcast More Than One Way to Lead Free Assembly

    Leo Lambert discusses the latest in lead-free assembly.


    Podcast RoHS revision draft

    Fern Abrams, IPC director of government relations and environmental policy, tells us the implications the RoHS revision may have on the industry.


    Top

    Market Research Presentations

    Slide Icon "Impact of the 2011 Disaster in Japan"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon "Trends in the Flexible Circuit Industry — Highlights from New IPC Studies"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live in Minneapolis, Minnesota during the IPC International Conference on Flexible Circuits, June 22, 2011

    Slide Icon "Market Update for the EMS Industry"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live as a webinar, December 14, 2010

    Slide Icon "Market Update for the PCB Industry"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live as a webinar, November 30, 2010

    Slide Icon "New Findings from the Latest IPC Studies"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live in Scottsdale, Arizona during the IPC Electronics Industry Executive Summit, October 21-22, 2009

    Slide Icon "Good Industry Statistics: Where to Find Them and What They Mean"

    Presentation by Sharon Starr, Director of Market Research for IPC

    This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

    Slide Icon "Emerging Applications and Material Issues for Embedded Components"

    Presentation by Karen Carpenter of TechSearch International

    This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

    Slide Icon "The Business of Managing Innovation: What Decision Makers Need to Know"

    Presentation by Shauzab H. Ladha of IBM

    This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

    Slide Icon "The Inevitable Transition to HDI Boards"

    Presentation by Martin Rausch of Intel Corporation

    This presentation was recorded live in Las Vegas, Nevada at IPC’s Executive Market & Technology Forum, October 24, 2007

    Podcast IPC Market Research

    Sharon Starr, director of market research for IPC, illustrates some of the industry data available to IPC members and explains how the information can be used to help companies thrive.

     

    Podcast The road to the industry’s recovery

    IPC’s Supply Chain Tracker offers important insights into the health of the electronics interconnect industry. Sharon Starr, director of market research for IPC, talks about some encouraging industry data for IPC’s members.

     
    Top

    Government Relations Presentations

    Slide Icon"Conflict Minerals: It Can and Will Impact the Electronics Industry"

    Presentation by Fern Abrams of IPC

    This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

    Slide Icon"Trade Adjustment Assistance for Firms"

    Presentation by Dr. John Mercer of MidAtlantic Trade Adjustment Assistance Center (MATAAC)

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"Surviving & Thriving"

    Presentation by David Hollingsworth of Ascentron

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"The World View: Factors Impacting American Competitiveness"

    Presentation by Philip Plonski of Prismark Partners, LLC

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"Start Over vs. Start Up"

    Presentation by Mark Northrup of IEC Electronics

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"How US Electronics Manufacturers are Ensuring Their Competitiveness"

    Presentation by Nilesh Naik of the OneSourceGroup

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"How U.S. Manufacturers Are Ensuring Their Competitiveness"

    Presentation by Mark Kannenberg of RBP Chemical Technology, Inc.

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"How to Lobby: Effectively Communicating with Congress"

    Presentation by Liz Reilly of the National Confectioners Association

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"Regulations: The Hidden Tax That Stops Economic Growth In America"

    Presentation by David McIntosh, former Congressman, now of Meyer Brown, LLP

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

    Slide Icon"The Political Climate's Impact on the Industry"

    Presentation by Fern Abrams, Director, Government Relations and Environmental Policy, IPC

    This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

    Book "The Movement to Ban Conflict Metals: It Can and Will Impact the Electronics Industry"

    Presentation by:
    • Anthony Hilvers, Vice President, Industry Programs, IPC
    • Kay Nimmo, ITRI
    • Fern Abrams, Director, Government Relations and Environmental Policy, IPC

    This webinar took place on October 8, 2010

    Slide Icon "The Directorate of Defense Trade Controls Overview"

    Presentation by Candace M.J. Goforth, Directorate of Defense Trade Controls, U.S. Department of State

    This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

    Slide Icon "DoD PCB Executive Agent"

    Presentation by Ron Chamrin, Manager of Government Relations for IPC

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

    Slide Icon "How to Effectively Lobby"

    Presentation by Martha Cogdell of Rockwell Collins

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

    Slide Icon "Net Operating Loss Relief"

    Presentation by Monica McGuire of the National Association of Manufacturers (NAM)

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

    Slide Icon "Research and Development Tax Credits"

    Presentation by Karen Magee Myers of CA, Inc.

    This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

    Podcast Understanding ITAR

    Joe O'Neil explains best practices for these often misunderstood regulations.


    Top

     

     

  • 天津2018年大气污染防治工作方案出台 2019-06-11
  • 高考评卷在三所高校进行 确保高质高效完成评卷任务 2019-06-11
  • 大米-热门标签-华商生活 2019-06-03
  • “大头儿子”著作权纠纷案二审开庭 2019-06-01
  • 习近平为诊治“长江病”把脉开方 2019-06-01
  • 护肤品达不到的效果怎么办? 让这些网红皮肤管理项目来帮你 2019-05-25
  • 【北京中汽双会车型报价】北京中汽双会4S店车型价格 2019-05-25
  • 昌都市图书馆首个全民阅读推广项目结题 2019-05-21
  • 靠山山倒不如靠自己。远水救不了近火,这样的简单道理都不懂该有这样一劫 2019-05-19
  • 习近平集体会见上海合作组织成员国安全会议秘书会议外方代表团团长 2019-05-19
  • 上港竟遭日球队头球羞辱 球迷:这么踢出局不远了 2019-05-14
  • 民主党派中央和全国工商联领导人记者会 2019-05-14
  • 西藏已具备血液核酸检测能力 2019-05-13
  • 印度公司食言,坑惨了缅甸商人! 2019-05-13
  • [网连中国]赛龙舟 包粽子 办诗会……全国各地品民俗迎端午 2019-05-12