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  • 人民网评:马克思主义照亮了人类解放道路 2019-08-15
  • 马克思主义通过指导无产阶级革命建立起部分社会财富公有制而改变了人类历史发展进程,离开部分社会财富公有制的建立来谈“改变人类历史发展进程”纯粹是无稽之谈。 2019-08-14
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  • 内蒙快三推荐与预测: IPC Status of Standardization

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    Status of Standardization


    Published Standards
    IPC-7095D-WAM1 August 2019 Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), with Amendment 1
    IPC-HERMES-9852 June 2019 The Global Standard for Machine-to-Machine Communication in SMT Assembly
    IPC-2231 May 2019 DFX Guidelines
    IPC-1754 WAM 1 April 2019 Materials and Substances Declaration for Aerospace and Defense and Other Industries
    IPC-2591 April 2019 Connected Factory Exchange (CFX)
    IPC-1791 Am1 April 2019 Trusted Electronic Designer, Fabricator and Assembler Requirements – Amendment 1
    IPC-9111 February 2019 Troubleshooting for Printed Board Assembly Processes


    Translations
    IPC-A-600J-ZH August 2019 印製板的可接受性 (Chinese (Zhōngwén) Language)
    IPC-2591-DE August 2019 Datenaustausch in der vernetzten Fabrik (CFX) (German language)
    IPC-4202B-CN August 2019 挠性印制板用挠性基底电介质 (Chinese language)
    6012DS-PL August 2019 Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolno?ci i Osi?gów dla Sztywnych P?yt Drukowanych (Polish language)
    IPC-6012D-PL August 2019 Specyfikacja Zdolno?ci i Osi?gów dla Sztywnych P?yt Drukowanych (Polish language)
    J-STD-001G Am 1-CN July 2019 焊接的电?和电?组件要求 修订本1 (Chinese language)
    J-STD-001G Am 1-JP July 2019 はんだ付される電気及び電子組立品に関する要件事項 改訂1 (Japanese language)
    A-610G-ZH July 2019 電子組件的可接受性 (Chinese-Zhōngwén language)
    IPC-A-620C-ZH July 2019 線纜及線束組件的要求與驗收 (Chinese-Zhōngwén language)
    IPC-9204-CN June 2019 印刷电子柔性与可拉伸性能测试指南 (Chinese language)
    IPC-6012DA-JP June 2019 IPC-6012D リジッドプリント板の認定および性能仕様車載用途向け追加規格 (Japanese language)
    IPC-6012DS-JP June 2019 リジッドプリント板の認定および性能仕様宇宙?軍用アビオニクス用途向け追加規格 (Japanese language)
    IPC-CC-830C-CN May 2019 印制线路组件用电气绝缘化合物的鉴定及性能 (Chinese language)
    IPC-7530A-CN May 2019 群焊工艺温度曲线指南(再流焊和波峰焊)(Chinese language)
    IPC-A-610G-PL May 2019 Dopuszczalno?? Zespo?ów Elektronicznych (Polish language)
    IPC-A-640-CN May 2019 光纤,光缆和混合线束组件的验收要求 (Chinese language)
    IPC-AJ-820A-CN May 2019 组装和连接手册 (Chinese language)
    IPC-7711/21C-PL May 2019 Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespo?ów Elektronicznych (Polish language)
    IPC-A-610G-VN April 2019 Tiêu Chu?n Ch?p Nh?n Các S?n Ph?m L?p Ráp ?i?n T? (Vietnamese language)
    IPC-1601A-PL April 2019 Wytyczne dla obs?ugiwania i przechowywania p?yt drukowanych (Polish language)
    IPC-7711/21C-NL (Chapter 1) April 2019 Rework, modificatie en repair van elektronische assemblages (Dutch language)
    J-STD-001G-VN April 2019 Các Yêu C?u Cho Các S?n Ph?m ?i?n và ?i?n T? Hàn L?p Ráp (Vietnamese language)
    IPC-A-600J-PL April 2019 Kryteria Dopuszczenia P?yt Drukowanych (Polish language)
    IPC/WHMA-A-620C-HU April 2019 Kábel- és huzalk?teg-szerelvények k?vetelményei és elfogadása (Hungarian language)
    IPC-HDBK-005-CN April 2019 电子产品的制造和供应链可追溯性标准 (Chinese language)
    IPC/WHMA-A-620C-S-CN April 2019 IPC/WHMA-A-620C航天应用电子部件补充标准 (Chinese language)
    IPC-1601A-CN April 2019 印制板操作和储存指南 (Chinese language)
    IPC-4921A-CN April 2019 印刷电子基材(基板)要求 (Chinese language)
    IPC-J-STD-001GS-CN April 2019 焊接的电气和电子组件要求航天和军事应用电子部件补充标准 (Chinese language)
    IPC-1782-CN April 2019 电子产品的制造和供应链可追溯性标准 (Chinese language)
    IPC-6018C-CN April 2019 高频(微波)印制板的鉴定及性能规范 (Chinese language)
    IPC/WHMA-A-620C-KR March 2019 ??? ? ??? ??? ?????? ?? ??? ? ?? (Korean language)
    IPC/WHMA-A-620C-VN March 2019 Yêu C?u và Tiêu Chu?n Ch?p Nh?n cho Các B? Day và B? Cáp D?n ?i?n (Vietnamese language)
    IPC-6012D-AM1-JP March 2019 リジッドプリント板の認定および性能仕様-改定1 (Japanese language)
    J-STD-001G-TH March 2019 ??????????????????????????????????????????????????????????????? (Thai language)
    IPC-6012D-JP March 2019 リジッドプリント板の認定および性能仕様 (Japanese language)
    J-STD-001G-AM1-SP March 2019 Provee requisitos para materiales de soldadura y procesos para ensambles (Spanish language)
    J-STD-001G-AM1-DE March 2019 Enth?lt Anforderungen für L?tmaterialien und -prozesse für elektronische Baugruppen (German language)
    J-STD-001G-AM1-FR March 2019 Les exigences relatives au brasage d’assemblages électroniques et électriques (French language)
    J-STD-001G-IT February 2019 Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici (Italian language)
    J-STD-001G-PL February 2019 Wymagania dla lutowanych zespo?ów elektrycznych i elektronicznych (Polish language)
    IPC-6013D-PL February 2019 Specyfikacja Zdolno?ci i Osi?gów dla Elastycznych / Sztywno-Elastycznych P?yt Drukowanych (Polish language)
    IPC/JEDEC-J-STD-033D-SP February 2019 Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso (Spanish language)
    IPC-A-620C-PL February 2019 Wymagania i akceptacje dla monta?u kabli i wi?zek przewodów (Polish language)


    Proposed Standard for Ballot
    IPC-7526A Stencil and Misprinted Board Cleaning Handbook
    IPC-9121 Am2 Troubleshooting for Printed Board Fabrication Processes - Amendment 2


    Final Draft for Industry Review
    IPC-A-610GC IPC-A-610 Revision G Telecom Addendum
    IPC-1755A Responsible Sourcing of Minerals Data Exchange Standard - Revision A
    IPC-6012E Qualification and Performance Specification for Rigid Printed Boards


    Working Draft
    IPC-HDBK-005A Guide to Solder Paste Assessment
    IPC-A-600K Acceptability of Printed Boards
    IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
    IPC-2221C Generic Standard on Printed Board Design
    IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
    IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
    IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
    IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
    IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
    IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
    IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
    IPC-7991 Process Guideline for 3D Printed Electronics
    IPC-8921 Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns
    IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
    IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
    IPC-9242 Guidelines for Microsection Evaluation
    IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
    IPC-9797 Press-fit Standard for Automotive Requirements and other high-reliability applications


    Project Approved
    IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
    J-STD-003C Am2 Solderability Tests for Printed Boards
    IPC/WHMA-A-620D Requirements and Acceptance for Cable and Wire Harness Assemblies
    IPC/WHMA-A-620DS Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D.
    IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
    IPC-2611A Generic Requirements for Electronic Product Documentation
    IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
    IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
    IPC-4101E WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards
    IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
    IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
    IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
    IPC-7070 Guidelines for Printed Board Component Mounting
    IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard
    IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes


    Withdrawn
     


    Test Method Proposals


    SECTION 2.1 - 2.1 Visual Test Methods
    TM 2.1.7.2 Determining a Weave as Spread Glass


    SECTION 2.2 - 2.2 Dimensional Test Methods
    TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
    TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
    TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
    TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
    TM 2.2.20A Solder paste Metal Content by Weight


    SECTION 2.3 - 2.3 Chemical Test Methods
    TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
    TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
    TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
    TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
    TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
    TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
    TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning


    SECTION 2.4 - 2.4 Mechanical Test Methods
    TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
    TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
    TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
    TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
    TM 2.4.35A Solder Paste – Slump Test
    TM 2.4.43A Solder Paste - Solder Ball Test
    TM 2.4.45A Solder Paste – Wetting Test


    SECTION 2.5 - 2.5 Electrical Test Methods
    TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


    SECTION 2.6 - 2.6 Environmental Test Methods
    TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
    TM 2.6.3.7A Surface Insulation Resistance
    TM 2.6.14.1A Electrochemical Migration Resistance Test
    TM 2.6.15D Corrosion, Flux


    Test Methods Approved
     
     
  • 政法新媒体:“指尖创新”让司法服务更亲民 2019-08-18
  • 川美师生图绘总书记重庆团重要讲话精神 2019-08-18
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  • 人民网评:马克思主义照亮了人类解放道路 2019-08-15
  • 马克思主义通过指导无产阶级革命建立起部分社会财富公有制而改变了人类历史发展进程,离开部分社会财富公有制的建立来谈“改变人类历史发展进程”纯粹是无稽之谈。 2019-08-14
  • 2014首届丝绸之路经济带国际论坛现场 2019-08-14
  • 庭审直播成常态 告别选择性公开 2019-08-10
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